Palladium (+ 2) reduction: A key step for the electroless Ni metallization of insulating substrates by a tin-free process
M. Charbonnier, M. Romand, Y. Goepfert, D. Léonard, F. Bessueille and M. Bouadi
Thin Solid Films
Volume 515, Issue 4, 5 December 2006, Pages 1623-1633
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